| DATE | HS_CODE | Product Description | Trademark | Country | Net Weight | Statistical Cost | Place | Shipper Name | Consignee Name |
|---|
| 2017-09-02 | 3810100000 | Pastes for soldering or welding, consisting of metal, NOT contains ethylene. ALCOHOL: Lead Free Compatible solder paste Composition: METALLIC COMPONENT: Tin-SN (96,5%), CU-CU (0,7%), SILVER-AG (3,8%) - 89% of the total weight of the paste. is | *** | CHINA | 0.4 | 1,8 | *** | ***** | ***** |
| 2017-09-06 | 3810100000 | Lead-free solder paste LFM-48W TM-HP, Composition: 96.5% TIN, SILVER 3%, copper 0.5% Resin 12% by volume of paste, used in production of printed circuit boards for television, ART .: 0202-001830 - 440000 T; : HEESUNG MATERIAL LTD HEESUNG MATER | *** | KOREA REPUBLIC OF | 440 | 27551,67 | *** | ***** | ***** |
| 2017-09-07 | 3810100000 | Solder paste BEZOTMYVNAYA, COMPOSITION - TIN 55.8%, PB 32.4%, silver 1.8%, 10% FLUX supplied in plastic containers (BANKS) With a tight fitting lid BANK 0.5 kg each packed in cartons (box with foam SOLDERING PA | *** | POLAND | 175.78 | 11697,98 | *** | ***** | ***** |
| 2017-09-12 | 3810100000 | PASTE for soldering, consisting of metal and other materials, auxiliary materials for the industrial assembly of TV "SAMSUNG" lead-free solder paste, COMPOSITION: Metal components: Tin SN (96,5%), CU CU (0,5%), SILVER AG (3%) - | *** | KOREA REPUBLIC OF | 303.52 | 17753,38 | *** | ***** | ***** |
| 2017-09-13 | 3810100000 | Solder Paste "HEE PFM-78X HS-LM" for soldering, PH IS NEUTRAL not water-soluble, viscous mass of homogeneous silver-gray, odorless, melting point 140GRADUSOV Celsius, do not have the following composition: Tin | *** | KOREA REPUBLIC OF | 400 | 16000 | *** | ***** | ***** |
| 2017-09-13 | 3810100000 | PASTA SOLDERING For soldering electronic components to a circuit board on automated assembly lines. PASTE COMPOSITION: METAL POWDER - TIN (SN) = 80-90%; SILVER (AG) = 0,5-1%; Copper (CU) = 0,5-1%; BI (BI); INDIUM (IN) and flux TYPE RO (ROSIN) | *** | UNITED KINGDOM | 28.5 | 2110,55 | *** | ***** | ***** |
| 2017-09-20 | 3810100000 | PASTA FOR brazing FOR MILLING MACHINES AND IMPLANTATION CARTRIDGE CHIP with lead-free solder paste MB-TEC 5000 in the paste INCLUDED Chorus - 90% and fluxes (ROSIN) - 10%. Solder composition (97.5 TIN, SILVER 1.8; 0.7 CU) TEMPERATURE X | *** | UNITED STATES | 7.14 | 10052,4 | *** | ***** | ***** |
| 2017-09-20 | 3810100000 | Lead-free solder paste LFM-48W TM-HP, Composition: 96.5% TIN, SILVER 3%, copper 0.5% Resin 12% by volume of paste, used in production of printed circuit boards for television, ART .: 0202-001830 - 360000 T; : HEESUNG MATERIAL LTD HEESUNG MATER | *** | KOREA REPUBLIC OF | 360 | 22485,23 | *** | ***** | ***** |
| 2017-09-28 | 3810100000 | Pastes for soldering or welding, consisting of metal, NOT contains ethylene. ALCOHOL: Lead Free Compatible solder paste Composition: METALLIC COMPONENT: Tin-SN (96,5%), CU-CU (0,7%), SILVER-AG (3,8%) - 89% of the total weight of the paste. is | *** | TAIWAN CHINA | 4.54 | 20,05 | *** | ***** | ***** |
| 2017-09-29 | 3810100000 | Lead-free solder paste LFM-48W TM-HP, Composition: 96.5% TIN, SILVER 3%, copper 0.5% Resin 12% by volume of paste, used in production of printed circuit boards for television, ART .: 0202-001830 - 500000 T; : HEESUNG MATERIAL LTD HEESUNG MATER | *** | KOREA REPUBLIC OF | 500 | 31001,64 | *** | ***** | ***** |