DATE | HS_CODE | Product Description | Trademark | Country | Net Weight | Statistical Cost | Place | Shipper Name | Consignee Name |
---|
2017-09-25 | 3907300000 | Composition of an epoxy-based, PRIM. In electronics, GROSS WEIGHT from the pallet - 197.000 KG CEL-3600XC-2W EPOXY MOLDING COMPOUND, 14MM X 6.6G / CEL-3600XC-2W compound for sealing the chips, tablets with a diameter of 14mm, height 21.8MM, WEIGHT pack. 6.6G, polymeric MATE | *** | GERMANY | 105 | 1025,01 | *** | ***** | ***** |
2017-09-25 | 3907300000 | Composition of an epoxy-based, PRIM. In electronics, GROSS WEIGHT from the pallet - 197.000 KG CEL-3600XC-2W EPOXY MOLDING COMPOUND, 14MM X 6.6G / CEL-3600XC-2W compound for sealing the chips, tablets with a diameter of 14mm, height 21.8MM, WEIGHT pack. 6.6G, polymeric MATE | *** | GERMANY | 105 | 1025,01 | *** | ***** | ***** |
2017-10-10 | 3907300000 | EPOXY RESINS, Malaysia COMPOUND FOR SEALING CIRCUITS CE-1700HF17R on metal leadframes (SILICON OXIDE COMPOSITION -78.2% QUARTZ - 3.3%, octamethylcyclotetrasiloxane - 0.3%, FENOLBIFENILENOVAYA RESIN - 18.2% TABLETS DIAMETER 14 mm, weight 5 | *** | MALAYSIA | 2 | 694,29 | *** | ***** | ***** |
2017-10-30 | 3907300000 | Epoxy compounds (pressure material) in tablets 100g DIAMETER 55MM *: KL-1000-3A - 315 cardboard box 15 kg. : CHEMICAL COMPOSITION EPOXY RESIN-90-95%, phenol-formaldehyde resins, 5-10% 3-TRIMETOKSISILILPROPAN-1-thiol 0.1-1%, NOT CONTAINING ALCOHOL, P | *** | CHINA | 4725 | 34017,89 | *** | ***** | ***** |
2017-11-10 | 3907300000 | Samples of polymer material based on epoxy resin - MOLD-compound, in the form of tablets 14 mm in diameter, the color from gray to black is suitable for sealing encapsulation CIRCUITS IN THE PROCESS, PROVIDED FOR | SUMITOMO | JAPAN | 10 | 504,44 | LISSE | ***** | ***** |
2017-11-27 | 3907300000 | EPOXY casting compound KL-1000-3A, black color in the form of tablets having a diameter 55 mm and weight of 100 g - 405 kg. WITHOUT ALCOHOL CONTENT. It designed for sealing a light-emitting diode. SHIPPING carried out using dry ice PACKAGING | ABSENT | CHINA | 405 | 10411,23 | Lianyungang | ***** | ***** |
2017-11-30 | 3907300000 | Polymer materials based on epoxy resin, in the form of tablets 14 mm in diameter, used in the manufacture of integrated circuits, NOT CONTAIN ethanol and ozone-depleting substances COMPOSITION: SILICON DIOXIDE 65-75%, epoxy resin 10-20% | KYOCERA | JAPAN | 1080 | 34377,08 | TOKYO | ***** | ***** |