DATE | HS_CODE | Product Description | Trademark | Country | Net Weight | Statistical Cost | Place | Shipper Name | Consignee Name |
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2017-09-27 | 8486901000 | PART grinding apparatus HMI41 vacuum table for plate fixation. MATERIAL MANUFACTURING STEEL. ROUND IS A SUBJECT WITH THROUGH OTVETSIEM inside. On a table surface have grooves in the form of rings of different diameters (of 5) between the rings | *** | CHINA | 3520 | 9160 | *** | ***** | ***** |
2017-10-24 | 8486100009 | INSTALLATION grinding and polishing are intended for grinding and polishing of semiconductor PLACTIN in order to make the plate allowable size GAUGE surface flatness, through a combination of mechanical and chemical activity by grinding | ABSENT | UNITED KINGDOM | 138 | 63005,08 | GLASGOW | ***** | ***** |
2017-10-24 | 8486100009 | INSTALLATION grinding and polishing (with the kit), is designed to prepare semiconductor PLACTIN the process of production, by making the necessary size of the plate thickness and surface flatness, APPLY CYCLE Made ENIYA | ABSENT | UNITED KINGDOM | 880 | 410265,72 | ERSKINE FERRY ROAD OLD KILPATRICK GLAS | ***** | ***** |
2017-10-24 | 8486100009 | INSTALLATION chemical-mechanical polishing (with the kit), is designed to prepare a semiconductor wafer to a production process, by making the necessary size of the plate thickness and surface flatness, APPLY TO LUPROVO | ABSENT | UNITED KINGDOM | 290 | 86128,7 | ERSKINE FERRY ROAD OLD KILPATRICK GLAS | ***** | ***** |
2017-10-24 | 8486100009 | INSTALLATION grinding and polishing (with the kit), is designed to prepare semiconductor PLACTIN the process of production, by making the necessary size of the plate thickness and surface flatness, APPLY CYCLE Made ENIYA | ABSENT | UNITED KINGDOM | 880 | 410265,72 | ERSKINE FERRY ROAD OLD KILPATRICK GLAS | ***** | ***** |
2017-10-24 | 8486100009 | INSTALLATION grinding and polishing are intended for grinding and polishing of semiconductor PLACTIN in order to make the plate allowable size GAUGE surface flatness, through a combination of mechanical and chemical activity by grinding | ABSENT | UNITED KINGDOM | 138 | 63005,08 | GLASGOW | ***** | ***** |
2017-10-24 | 8486100009 | INSTALLATION chemical-mechanical polishing (with the kit), is designed to prepare a semiconductor wafer to a production process, by making the necessary size of the plate thickness and surface flatness, APPLY TO LUPROVO | ABSENT | UNITED KINGDOM | 290 | 86128,7 | ERSKINE FERRY ROAD OLD KILPATRICK GLAS | ***** | ***** |