DATE | HS_CODE | Product Description | Trademark | Country | Net Weight | Statistical Cost | Place | Shipper Name | Consignee Name |
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2017-10-04 | 7410210000 | The base material for printed circuit boards: copper foil into a dielectric substrate (epoxy resin and glass) | ISOLA | *** | 2010 | 60478,98 | RAUHA | ***** | ***** |
2017-10-11 | 7410210000 | The base material for printed circuit boards: copper foil into a dielectric substrate (epoxy resin and glass) | ISOLA | *** | 1850 | 46070,88 | RAUHA | ***** | ***** |
2017-10-25 | 7410210000 | The base material for printed circuit boards: copper foil into a dielectric substrate (epoxy resin and glass) | ISOLA | *** | 270 | 10424,11 | RAUHA | ***** | ***** |
2017-10-25 | 7410210000 | COPPER FOIL from refined (in leaves) no thicker than 0.15 mm, with a core of glass-cloth. It is used for manufacturing printed circuit boards for the electronics industry, mechanical engineering: | GEM | *** | 13995 | 74453,4 | SHANGHAI | ***** | ***** |
2017-10-28 | 7410210000 | Glass fiber sheet-foil, is a laminate of epoxy resin, reinforcing filler in which is fiberglass, on one or both sides covered with copper foil thickness GALVANOSTOYKOY ELECTROLYTIC | ABSENT | *** | 1672 | 9840,96 | SHANGHAI | ***** | ***** |
2017-11-09 | 7410210000 | The base material for printed circuit boards: copper foil into a dielectric substrate (epoxy resin and glass) | ISOLA | *** | 4810 | 100667,1 | RAUHA | ***** | ***** |
2017-11-09 | 7410210000 | The base material for printed circuit boards: copper foil into a dielectric substrate (epoxy resin and glass) | ISOLA | *** | 145 | 10331,01 | RAUHA | ***** | ***** |
2017-11-14 | 7410210000 | COPPER FOIL from refined (in leaves) no thicker than 0.15 mm, with a core of glass-cloth. It is used for manufacturing printed circuit boards for the electronics industry, mechanical engineering: | GEM | *** | 17205 | 103497,96 | SHANGHAI | ***** | ***** |
2017-11-16 | 7410210000 | FR-4 glass fiber: glass fiber COPPER SINGLE foil reinforced with a dielectric on the basis of glass mesh, impregnated and polymerized epoxy resins, FOIL - COPPER; INTENDED FOR MANUFACTURING PRINTED CIRCUIT BOARDS DIFFERENT CTE | not designated | *** | 19080 | 113036 | ORIENTAL | ***** | ***** |
2017-11-16 | 7410210000 | COPPER FOIL, coated on one or both sides of the BASIC dielectric material (glass fiber laminate) - foiled dielectrics, in sheets - 4,740 sheets. CHARACTERISTICS: Thickness of copper foil - FROM TO 0.018MM 0.035MM. Goods packed in | ABSENT | *** | 15356 | 121247,8 | SUZHOU | ***** | ***** |