DATE | HS_CODE | Product Description | Trademark | Country | Net Weight | Statistical Cost | Place | Shipper Name | Consignee Name |
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2017-09-05 | 8534001100 | A multilayer printed circuit, consisting only of the conductive element and the contact to be built into luminaires: It consists of the aluminum substrate, FR4 - DIELEKTICHESKOGO layer foil pads. Free of other passive and active ale | *** | TAIWAN CHINA | 777.5 | 27786,62 | *** | ***** | ***** |
2017-09-09 | 8534001100 | A multilayer printed circuit (4-layer): a plate of insulating material (glass-cloth), which are deposited on the surface of the electroconductive thin STRIPS (printed conductors), with the contact pads for connecting the implement RADIO: PLA | *** | CHINA | 192.4 | 8828,61 | *** | ***** | ***** |
2017-09-11 | 8534001100 | A multilayer printed circuit: a multilayer circuit board (dielectric base of a polymer glass-reinforced with conductive tracks, contact pads, installation and vias), does not contain other active and passive | *** | CHINA | 246 | 16110,95 | *** | ***** | ***** |
2017-09-12 | 8534001100 | A multilayer printed circuit: printed circuit board multilayer circuit board (dielectric base of a polymer glass-reinforced with conductive tracks, contact pads, installation and vias), does not contain other PASS | *** | CHINA | 1112 | 108669,81 | *** | ***** | ***** |
2017-09-12 | 8534001100 | With the multilayer printed circuit wiring and the contact pads, without establishing ELEMENTS INTENDED FOR USE IN TELECOMMUNICATIONS EQUIPMENT multilayer printed circuit boards with conductive paths, without the establishment of EL | *** | MALAYSIA | 1.15 | 191,73 | *** | ***** | ***** |
2017-09-12 | 8534001100 | With the multilayer printed circuit wiring and the contact pads, without establishing ELEMENTS INTENDED FOR USE IN TELECOMMUNICATIONS EQUIPMENT multilayer printed circuit boards with conductive paths, without the establishment of EL | *** | MALAYSIA | 2.04 | 449,19 | *** | ***** | ***** |
2017-09-12 | 8534001100 | With the multilayer printed circuit wiring and the contact pads, without establishing ELEMENTS INTENDED FOR USE IN TELECOMMUNICATIONS EQUIPMENT multilayer printed circuit boards with conductive paths, without the establishment of EL | *** | MALAYSIA | 1.45 | 327,87 | *** | ***** | ***** |
2017-09-12 | 8534001100 | With the multilayer printed circuit wiring and the contact pads, without establishing ELEMENTS INTENDED FOR USE IN TELECOMMUNICATIONS EQUIPMENT multilayer printed circuit boards with conductive paths, without the establishment of EL | *** | MALAYSIA | 1.09 | 276,4 | *** | ***** | ***** |
2017-09-12 | 8534001100 | With the multilayer printed circuit wiring and the contact pads, without establishing ELEMENTS INTENDED FOR USE IN TELECOMMUNICATIONS EQUIPMENT multilayer printed circuit boards with conductive paths, without the establishment of EL | *** | MALAYSIA | 1.37 | 261,44 | *** | ***** | ***** |
2017-09-12 | 8534001100 | With the multilayer printed circuit wiring and the contact pads, without establishing ELEMENTS INTENDED FOR USE IN TELECOMMUNICATIONS EQUIPMENT multilayer printed circuit boards with conductive paths, without the establishment of EL | *** | MALAYSIA | 1.35 | 243,11 | *** | ***** | ***** |