DATE | HS_CODE | Product Description | Trademark | Country | Net Weight | Statistical Cost | Place | Shipper Name | Consignee Name |
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2017-09-05 | 3910000008 | A silicone paste / computer, has high thermal conductivity and serves as a D / remove heat from the chip to the radiator system, with NOT CONTAIN ETHANOL,: thermal grease, silicone based DEEPCOOL Z5 Syringe 3g T.IMPEDANCE <0.159C-IN2 / W T. CON | *** | CHINA | 48.62 | 1913,56 | *** | ***** | ***** |
2017-09-05 | 3910000008 | A silicone paste / computer, has high thermal conductivity and serves as a D / remove heat from the chip to the radiator system, with NOT CONTAIN ethyl alcohol: silicone-based thermal grease DEEPCOOL Z5 Syringe 3g T.IMPEDANCE <0.159C-IN2 / W T. CON | *** | CHINA | 83.98 | 3263,49 | *** | ***** | ***** |
2017-09-05 | 3910000008 | Silicone paste for computers, has high thermal conductivity and is used to remove heat from the chip to a radiator COOLING SYSTEM, DOES NOT CONTAIN ETHANOL,: thermal grease, silicone based DEEPCOOL Z5 Syringe 3g T.IMPEDANCE <0.159C-IN2 / | *** | CHINA | 68.51 | 2809,43 | *** | ***** | ***** |
2017-09-05 | 3910000008 | PASTE thermally conductive (thermal grease) SURPLUSES FOR EXHAUST HEAT FROM CENTRAL PROCESSOR COMPUTER TO radiator to reduce overheating, the processor. DOES NOT CONTAIN ETHANOL. SOSTAV- SILICON DIOXIDE 15% ALUMINUM OXIDE 60% zinc oxide 24%, PASTA T | *** | CHINA | 18.43 | 1555,55 | *** | ***** | ***** |
2017-09-05 | 3910000008 | PASTE thermally conductive (thermal grease) SURPLUSES FOR EXHAUST HEAT FROM CENTRAL PROCESSOR COMPUTER TO radiator to reduce overheating, the processor. DOES NOT CONTAIN ETHANOL. SOSTAV- SILICON DIOXIDE 15% ALUMINUM OXIDE 60% zinc oxide 24%, PASTA T | *** | CHINA | 6.35 | 565,59 | *** | ***** | ***** |
2017-09-07 | 3910000008 | Thermal Grease silicone-based for better heat conduction between the fuel elements of the electronic circuit and a radiator (do not contain ethyl alcohol) (NOT FOR USE IN DRINKING WATER SUPPLY): in individual packs of 4 grams WAKEFIELD-VETTE B | *** | KOREA REPUBLIC OF | 0.02 | 6,72 | *** | ***** | ***** |
2017-09-08 | 3910000008 | Silicone paste for computers, has high thermal conductivity and is used to remove heat from the chip to a radiator COOLING SYSTEM, DOES NOT CONTAIN ETHANOL, thermopaste 480354-001 HP HEWLETT-PACKARD CO. HP HP 480354-001 480354-001 1 | *** | CHINA | 0.04 | 75,02 | *** | ***** | ***** |
2017-09-08 | 3910000008 | Silicone paste for computers, has high thermal conductivity and is used to remove heat from the chip to a radiator COOLING SYSTEM, DOES NOT CONTAIN ETHANOL, thermopaste 480354-001 HP HEWLETT-PACKARD CO. HP HP 480354-001 480354-001 1 | *** | CHINA | 0.04 | 75,02 | *** | ***** | ***** |
2017-09-28 | 3910000008 | Silicone paste for computers, has high thermal conductivity and is used to remove heat from the chip to a radiator COOLING SYSTEM, DOES NOT CONTAIN ETHANOL, thermopaste TITAN TTG-G30015 NANO GREASE SYRINGE 1.5g of silicone-based TITAN | *** | CHINA | 28.88 | 1096,17 | *** | ***** | ***** |
2017-09-28 | 3910000008 | Silicone paste for computers, has high thermal conductivity and is used to remove heat from the chip to a radiator COOLING SYSTEM, DOES NOT CONTAIN ETHANOL, thermopaste TITAN TTG-G30015 NANO GREASE SYRINGE 1.5g of silicone-based TITAN | *** | CHINA | 28.88 | 1096,17 | *** | ***** | ***** |