DATE | HS_CODE | Product Description | Trademark | Country | Net Weight | Statistical Cost | Place | Shipper Name | Consignee Name |
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2017-09-11 | 3907300000 | EPOXY RESIN (liquids and pastes WITHOUT SOD.ETIL.SPIRTA) MEDIUM VISCOSITY EPOXY RESIN COMPOSITION COMPONENT B (m-xylylenediamine, 65-70%, 15-20% NONYLPHENOL-3-6-1-2,5-DIAZOKTANIETILENIDINAMIN % fatty acid, 20-25% polyamine amide) TREATMENT cover ISPOLZ.DLYA | *** | JAPAN | 171 | 799,53 | *** | ***** | ***** |
2017-09-11 | 3907300000 | EPOXY RESIN (liquids and pastes WITHOUT SOD.ETIL.SPIRTA) MEDIUM VISCOSITY EPOXY RESIN COMPOSITION COMPONENT B (m-xylylenediamine, 65-70%, 15-20% NONYLPHENOL-3-6-1-2,5-DIAZOKTANIETILENIDINAMIN % fatty acid, 20-25% polyamine amide) TREATMENT cover ISPOLZ.DLYA | *** | JAPAN | 171 | 799,53 | *** | ***** | ***** |
2017-09-25 | 3907300000 | Epoxide resins, not containing products. EPOXY CEMENT. Component adhesive BONDING COMPOSITION FOR A PARTICULAR portion of the endoscope DURING THE REPAIR OF MEDICAL EQUIPMENT "PENTAX". Composition: epoxy resin E | *** | JAPAN | 0.22 | 72,11 | *** | ***** | ***** |
2017-09-25 | 3907300000 | Epoxide resins, not containing products. EPOXY CEMENT. Component adhesive BONDING COMPOSITION FOR A PARTICULAR portion of the endoscope DURING THE REPAIR OF MEDICAL EQUIPMENT "PENTAX". Composition: epoxy resin E | *** | JAPAN | 0.22 | 72,11 | *** | ***** | ***** |
2017-10-16 | 3907300000 | Epoxide resins, for use in industrial manufacture of automotive polish (as raw components), not for retail sale, NOT CONTAIN ethanol and ozone-depleting substances modified epoxy resin BUTADIENAKRILONITRIL | *** | JAPAN | 3523 | 41481,5 | *** | ***** | ***** |
2017-10-22 | 3907300000 | EPOXY RESIN FOR CIRCUITS NAMICS U8410-73A UNDERFILL 10CCM (10GR SYRINGE) / POLYMER MATERIAL U8410-73A, SYRINGE 10SS (10 oz.) TRANSPORT overlaid dry ice NAMICS U8410-302 UNDERFILL 10CCM (10GR SYRINGE) / LIQUID POLYMER MATERIAL NAMICS U | *** | JAPAN | 0.29 | 1949,93 | *** | ***** | ***** |
2017-11-05 | 3907300000 | Epoxide resins, / NO SOD.SPIRTA not for use in the practice of domestic water supply, NOT FOR USE IN THE MANUFACTURE OF FOOD / | CEMEDINE | JAPAN | 1.7 | 264,71 | PLOVDIV | ***** | ***** |
2017-11-10 | 3907300000 | Samples of polymer material based on epoxy resin - MOLD-compound, in the form of tablets 14 mm in diameter, the color from gray to black is suitable for sealing encapsulation CIRCUITS IN THE PROCESS, PROVIDED FOR | SUMITOMO | JAPAN | 10 | 504,44 | LISSE | ***** | ***** |
2017-11-30 | 3907300000 | Polymer materials based on epoxy resin, in the form of tablets 14 mm in diameter, used in the manufacture of integrated circuits, NOT CONTAIN ethanol and ozone-depleting substances COMPOSITION: SILICON DIOXIDE 65-75%, epoxy resin 10-20% | KYOCERA | JAPAN | 1080 | 34377,08 | TOKYO | ***** | ***** |