DATE | HS_CODE | Product Description | Trademark | Country | Net Weight | Statistical Cost | Place | Shipper Name | Consignee Name |
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2017-09-06 | 3810100000 | Lead-free solder paste LFM-48W TM-HP, Composition: 96.5% TIN, SILVER 3%, copper 0.5% Resin 12% by volume of paste, used in production of printed circuit boards for television, ART .: 0202-001830 - 440000 T; : HEESUNG MATERIAL LTD HEESUNG MATER | *** | KOREA REPUBLIC OF | 440 | 27551,67 | *** | ***** | ***** |
2017-09-12 | 3810100000 | PASTE for soldering, consisting of metal and other materials, auxiliary materials for the industrial assembly of TV "SAMSUNG" lead-free solder paste, COMPOSITION: Metal components: Tin SN (96,5%), CU CU (0,5%), SILVER AG (3%) - | *** | KOREA REPUBLIC OF | 303.52 | 17753,38 | *** | ***** | ***** |
2017-09-13 | 3810100000 | Solder Paste "HEE PFM-78X HS-LM" for soldering, PH IS NEUTRAL not water-soluble, viscous mass of homogeneous silver-gray, odorless, melting point 140GRADUSOV Celsius, do not have the following composition: Tin | *** | KOREA REPUBLIC OF | 400 | 16000 | *** | ***** | ***** |
2017-09-20 | 3810100000 | Lead-free solder paste LFM-48W TM-HP, Composition: 96.5% TIN, SILVER 3%, copper 0.5% Resin 12% by volume of paste, used in production of printed circuit boards for television, ART .: 0202-001830 - 360000 T; : HEESUNG MATERIAL LTD HEESUNG MATER | *** | KOREA REPUBLIC OF | 360 | 22485,23 | *** | ***** | ***** |
2017-09-29 | 3810100000 | Lead-free solder paste LFM-48W TM-HP, Composition: 96.5% TIN, SILVER 3%, copper 0.5% Resin 12% by volume of paste, used in production of printed circuit boards for television, ART .: 0202-001830 - 500000 T; : HEESUNG MATERIAL LTD HEESUNG MATER | *** | KOREA REPUBLIC OF | 500 | 31001,64 | *** | ***** | ***** |
2017-11-08 | 3810100000 | Lead-free solder paste LFM-48W TM-HP, Composition: 96.5% TIN, SILVER 3%, copper 0.5% Resin 12% by volume of paste, used in production of printed circuit boards for television, ART .: 0202-001830 - 300000 T; | HEESUNG MATERIAL | KOREA REPUBLIC OF | 300 | 18042 | Incheon | ***** | ***** |
2017-11-15 | 3810100000 | Lead-free solder paste LFM-48W TM-HP, Composition: 96.5% TIN, SILVER 3%, copper 0.5% Resin 12% by volume of paste, used in production of printed circuit boards for television, ART .: 0202-001830 - 240000 T; | HEESUNG MATERIAL | KOREA REPUBLIC OF | 240 | 14181,86 | Incheon | ***** | ***** |
2017-11-15 | 3810100000 | Solder Paste "HEE PFM-78X HS-LM" for soldering, PH IS NEUTRAL not water-soluble, viscous mass of homogeneous silver-gray, odorless, melting point 140GRADUSOV Celsius, do not have the following | HEESUNG MATERIAL., LTD | KOREA REPUBLIC OF | 400 | 16000 | MOSCOW | ***** | ***** |
2017-11-22 | 3810100000 | Lead-free solder paste LFM-48W TM-HP, Composition: 96.5% TIN, SILVER 3%, copper 0.5% Resin 12% by volume of paste, used in production of printed circuit boards for television, ART .: 0202-001830 - 40000 T; | HEESUNG MATERIAL | KOREA REPUBLIC OF | 45.9 | 2475,17 | Incheon | ***** | ***** |
2017-11-30 | 3810100000 | Lead-free solder paste LFM-48W TM-HP, Composition: 96.5% TIN, SILVER 3%, copper 0.5% Resin 12% by volume of paste, used in production of printed circuit boards for television, ART .: 0202-001830 - 140000 T; | HEESUNG MATERIAL | KOREA REPUBLIC OF | 140 | 8509,89 | Incheon | ***** | ***** |