DATE | HS_CODE | Product Description | Trademark | Country | Net Weight | Statistical Cost | Place | Shipper Name | Consignee Name |
---|
2017-09-06 | 3810100000 | Lead-free solder paste LFM-48W TM-HP, Composition: 96.5% TIN, SILVER 3%, copper 0.5% Resin 12% by volume of paste, used in production of printed circuit boards for television, ART .: 0202-001830 - 440000 T; : HEESUNG MATERIAL LTD HEESUNG MATER | *** | KOREA REPUBLIC OF | 440 | 27551,67 | *** | ***** | ***** |
2017-09-20 | 3810100000 | Lead-free solder paste LFM-48W TM-HP, Composition: 96.5% TIN, SILVER 3%, copper 0.5% Resin 12% by volume of paste, used in production of printed circuit boards for television, ART .: 0202-001830 - 360000 T; : HEESUNG MATERIAL LTD HEESUNG MATER | *** | KOREA REPUBLIC OF | 360 | 22485,23 | *** | ***** | ***** |
2017-09-29 | 3810100000 | Lead-free solder paste LFM-48W TM-HP, Composition: 96.5% TIN, SILVER 3%, copper 0.5% Resin 12% by volume of paste, used in production of printed circuit boards for television, ART .: 0202-001830 - 500000 T; : HEESUNG MATERIAL LTD HEESUNG MATER | *** | KOREA REPUBLIC OF | 500 | 31001,64 | *** | ***** | ***** |
2017-11-08 | 3810100000 | Lead-free solder paste LFM-48W TM-HP, Composition: 96.5% TIN, SILVER 3%, copper 0.5% Resin 12% by volume of paste, used in production of printed circuit boards for television, ART .: 0202-001830 - 300000 T; | HEESUNG MATERIAL | KOREA REPUBLIC OF | 300 | 18042 | Incheon | ***** | ***** |
2017-11-15 | 3810100000 | Lead-free solder paste LFM-48W TM-HP, Composition: 96.5% TIN, SILVER 3%, copper 0.5% Resin 12% by volume of paste, used in production of printed circuit boards for television, ART .: 0202-001830 - 240000 T; | HEESUNG MATERIAL | KOREA REPUBLIC OF | 240 | 14181,86 | Incheon | ***** | ***** |
2017-11-22 | 3810100000 | Lead-free solder paste LFM-48W TM-HP, Composition: 96.5% TIN, SILVER 3%, copper 0.5% Resin 12% by volume of paste, used in production of printed circuit boards for television, ART .: 0202-001830 - 40000 T; | HEESUNG MATERIAL | KOREA REPUBLIC OF | 45.9 | 2475,17 | Incheon | ***** | ***** |
2017-11-30 | 3810100000 | Lead-free solder paste LFM-48W TM-HP, Composition: 96.5% TIN, SILVER 3%, copper 0.5% Resin 12% by volume of paste, used in production of printed circuit boards for television, ART .: 0202-001830 - 140000 T; | HEESUNG MATERIAL | KOREA REPUBLIC OF | 140 | 8509,89 | Incheon | ***** | ***** |