DATE | HS_CODE | Product Description | Trademark | Country | Net Weight | Statistical Cost | Place | Shipper Name | Consignee Name |
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2017-09-04 | 8486209009 | The DTX - INSTALLATION scribing and separation into chips - 1 PCS. HOW IT WORKS: using a diamond cutter to move along the surface of semiconductor wafers up to 200 mm along the line of scribing, separated by a single crystal at the surface: semiconductors | *** | UNITED STATES | 650 | 454845,99 | *** | ***** | ***** |
2017-09-05 | 8486209003 | To remove the photoresist AND TREATMENT OF SEMICONDUCTOR PLATES: INSTALLATION plasma clearance ATTO, at a specified EQUIPMENT is designed for plasma-chemical processing of semiconductor wafers and substrates up to 200 mm in diameter for issl | *** | GERMANY | 58 | 10124,18 | *** | ***** | ***** |
2017-09-07 | 8486209009 | MACHINERY, EQUIPMENT FOR OL-VA semiconductor devices, electronic. INTEGRATED CIRCUITS 7000 0004 CLEANING SYSTEM OKO2000MP / 7000 0004 CLEANING SYSTEM OKO2000MP with microprocessor control is intended for aqueous cleaning semiconductor wafers, hard | *** | UNITED KINGDOM | 154 | 10781,15 | *** | ***** | ***** |
2017-09-15 | 8486209005 | INSTALLATION OF DOUBLE-SIDED COMBINATION AND EXPOSURE, used for accurate registration of images on the mask and the wafer front and back side as well as carry out the process under controlled EXPOSURE DOSE UV ILD STATUS | *** | UNITED STATES | 415 | 80915,85 | *** | ***** | ***** |
2017-09-15 | 8486909008 | Let cool for a base in the form of complex TECHNOLOGY PRODUCTS as a plate made of aluminum with holes for fastening & P holes for the installation of a silicon wafer, YAVL.CHASTYU INSTALLATION TRYMAX NEO2000: PROVIDE NOT FOR SALE FOR THIS INSTALLATION | *** | NETHERLANDS | 6.1 | 1111,25 | *** | ***** | ***** |
2017-09-20 | 8486209009 | INSTALLATION plasma etching inductively coupled plasma ART: CORIAL 210IL INTENDED: for etching different layers on semiconductor wafers. Plasma etching - a technology and dry etching is used to remove a portion of F | *** | FRANCE | 940 | 450783,52 | *** | ***** | ***** |
2017-09-21 | 8486209009 | INSTALLATION plasma treatment of surfaces of semiconductor wafers are used in the semiconductor industry Manufacturing Cycle microelectronic components, not for military purposes, NOT FOR MEDICINE, AND DOES NOT CONSTITUTE RES VCHU.POSTAVLYAETSYA PER HOUR: | *** | GERMANY | 106 | 30150,49 | *** | ***** | ***** |
2017-09-26 | 8486100009 | Technological equipment for plates of monocrystal KREMNIYA- Machine for cutting ingots (boules) monocrystalline silicon into thin wafers with a diamond WIRE:: WIRE CUTTING MACHINE NTC PV500D, were in operation, | *** | JAPAN | 8920 | 178000 | *** | ***** | ***** |
2017-10-04 | 8486909008 | PARTS EXCLUSIVELY intended for installation JUSUNG GENAON PLUS ETCHING hard mask and the magnetic layers with plasma silicon wafers IN SEMICONDUCTOR MANUFACTURING: | JUSUNG | *** | 150 | 50319,93 | Gyeonggi | ***** | ***** |
2017-10-04 | 8486209003 | SYSTEM wet chemistry ULTRA-CLEAN wafer. Used in the manufacture of semiconductor devices and integrated circuits in the technological process of clearing of semiconductor wafers. DOES NOT CONTAIN SOURCES IONIZIRUYUSCHEG | ATP | GERMANY | 120 | 127732,92 | PUTTEN | ***** | ***** |