DATE | HS_CODE | Product Description | Trademark | Country | Net Weight | Statistical Cost | Place | Shipper Name | Consignee Name |
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2017-09-15 | 8542319010 | PLATE SEMICONDUCTOR SILICON STILL does not cut on a chip, round shape with a diameter of 300mm, thickness 775MKM. Wafer intended for production of semiconductor crystals (prepared by the method cutting): used to | *** | JAPAN | 34 | 212322,59 | *** | ***** | ***** |
2017-09-17 | 8541100009 | Other diodes, photodiodes THAN OR light-emitting diodes: diodes - a semiconductor wafer is cut into the crystal (located in the same building) for devices of industrial electronics: diodes Transient Voltage Suppressors (TVS). REVERSE | *** | JAPAN | 0.04 | 84,75 | *** | ***** | ***** |
2017-09-17 | 8541100009 | Other diodes, photodiodes THAN OR light-emitting diodes: diodes - a semiconductor wafer is cut into the crystal (located in the same building) for devices of industrial electronics: Schottky diodes. Forward current 3 A, Reverse Voltage 40V is not | *** | JAPAN | 0.01 | 2,17 | *** | ***** | ***** |
2017-09-19 | 8541100009 | DIODES - the semiconductor wafer is cut into the crystal (located in the same building), for devices of industrial electronics, ARE NOT diode grounders DEVICES catenary CLASSIFICATION CODE 6340112: Schottky diodes, reverse voltage of 40 V, DIRECT | *** | JAPAN | 0.21 | 34,07 | *** | ***** | ***** |
2017-09-20 | 8536902000 | PROBES FOR VERIFICATION wafer, a standard spring with a pitch USE 100um, voltage 10V, PROBE MATERIAL - TUNGSTEN: Used as a single contact in the contact assemblies (PROBE HEAD) ELEKETRONNYH testers. PROBES CT | *** | JAPAN | 0.3 | 1462,98 | *** | ***** | ***** |
2017-09-23 | 8541100009 | DIODES - the semiconductor wafer is cut into the crystal (located in the same building) for devices of industrial electronics: DIODES GENERAL PURPOSE. REVERSE VOLTAGE 700V, CASING DIP-4. ARE NOT diode grounders DEVICES CONTACT: NO | *** | JAPAN | 4 | 319,17 | *** | ***** | ***** |
2017-09-26 | 8542399010 | Monolithic integrated circuits AS silicon wafers 300 mm in diameter integrated monolithic circuit is intended for production of chips for storing and transmitting information used in computer technology, electronic devices CIVIL | *** | JAPAN | 5.74 | 709,72 | *** | ***** | ***** |
2017-11-03 | 8536902000 | PROBES FOR VERIFICATION wafer, a standard spring with a pitch USE 100um, voltage 10V, PROBE MATERIAL - tungsten. NOT SCRAP ELECTRIC. | ABSENT | JAPAN | 0.27 | 1853,57 | TW TAO YUAN AIRPORT | ***** | ***** |
2017-11-28 | 8542399010 | Monolithic integrated circuits AS silicon wafers 300 mm in diameter. Test samples were intended for chip manufacturing TYPE "bioelectronic sensor" MEDICAL EQUIPMENT FOR CIVIL PURPOSE. ARE SM.DOPOLNENIE | ABSENT | JAPAN | 7.4 | 822,02 | Uozu | ***** | ***** |